# ASML to work with major chipmakers to use latest tools for larger chips

> **Open Intelligence Dossier** · First detected: 2026-09-08 13:07 UTC · Category: Business

## Executive Summary
ASML is partnering with Intel, Samsung, and TSMC to integrate High-NA EUV technology for the production of next-generation AI chips.

## Intelligence Brief
ASML has entered into collaborative agreements with several of the world's leading semiconductor firms to implement its latest toolsets for the manufacturing of larger, more advanced chips. According to reports from Intel.com and Yahoo Finance, Intel Foundry is working closely with ASML to accelerate the industry's overall readiness for High-NA EUV technology. Simultaneously, the Samsung Global Newsroom has announced that Samsung Electronics is expanding its strategic collaboration with ASML to enhance next-generation semiconductor manufacturing capabilities. These efforts are focused on integrating the most advanced lithography tools into existing production workflows. Coverage from Quartz emphasizes that the adoption of High-NA EUV machines is specifically targeted toward the production of AI chips.


Quartz reports that both TSMC and Samsung have committed to using these ASML machines to meet the growing demands of artificial intelligence hardware. The reporting across these various outlets—including corporate newsrooms and financial news sites—highlights a synchronized movement among the top chipmakers to adopt the same specialized hardware provided by ASML to maintain technical viability in the high-end chip market. This trend is significant because High-NA EUV represents the next evolution in extreme ultraviolet lithography, which is essential for shrinking transistors and increasing the density of chips. The involvement of Intel Foundry, Samsung Electronics, and TSMC suggests a broad industry shift toward these specific tools to achieve the precision required for the next generation of semiconductors. By collaborating with ASML, these companies aim to reduce the time it takes for the industry to become ready for these complex machines, ensuring that the transition from current EUV technology to High-NA EUV is seamless.


Looking ahead, the industry will monitor the progress of the strategic collaboration between Samsung Electronics and ASML as they expand their manufacturing efforts. Observers will also follow the readiness milestones established by Intel Foundry and ASML as they work to accelerate industry adoption. Further developments regarding how TSMC and Samsung integrate these specific machines into their AI chip production lines will be a primary focus, as these commitments signal a long-term reliance on ASML's high-numerical aperture technology to drive the next wave of semiconductor innovation.

## Multi-Source Evidence Table
| Source Outlet | Headline | Verification URL |
|---|---|---|
| intel.com | Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High-NA EUV | [Source Link](https://news.google.com/rss/articles/CBMi0wFBVV95cUxQSGoxM1M5c3RhLWI4amZzVEFQZ2h0MEVNZ1htd21SSmtsY0ZJTm00Zzd1TENxRUV4QVBjVlE1VUNhZFVPRjZtTHBfZ0FNdkxtREdSUm9QY0UzWExNVVMwRGhYRlBudVBVcnB3TkFOanMzOGhaSWFkdTlIS2FzTk5ZSnAtY3JZaDQ5Q0JRRE9HcTREVUpoWXV4S1ZiUGUxQlRNeTE4VndzY2w0QU1VcnJrNjdvWXFjVkQxb19hcnZhT05lUmp1cHZNUThENndmMm5kMGFv?oc=5) |
| Samsung Global Newsroom | Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing | [Source Link](https://news.google.com/rss/articles/CBMi1gFBVV95cUxOYkNpckVWbTZoSnY4R3d4bWdKTnR1LWZiQXE1ZGtQRVQxX0NEWnhmY1VkOEw1SWhSclZsRklyazhFVkFfOTJSd0VWWURBeGN6M2tSek1PZFA5MjJOU1d2V0NCYU5fT3RYSWF4YnhFODFSeFJBU2JfcGg3clE2Smswa0YzdkZEclloYUMtWUhYbzBIbHo3NVZmMlg5MHZZaGlOa2NfN3BXMjlabXh3ai03Tk9XWnRRdzRoM3dEeER0cTBEMVNTcUV1Q2xSLWgtV2JPOTcteGp3?oc=5) |
| Yahoo Finance | Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV | [Source Link](https://news.google.com/rss/articles/CBMipAFBVV95cUxPUjM3TTNIS0wwNmhvUlAwdGhLOXdjVUFXZ0YtXzBPTnFUeE0wN0IwMXdpaTROYUt5b2RPVUJ2UlAxb2pzZjJZZi14R3RpUS16YU5XemZQQldibWxwX0gyejU5SFRjZWlTc05FSUl4a3RUYURwSUloVFlTcHhPbUM3UkN6NW1MUHkyWi01a0lNNTRJRF90V2FNZ0lpdFRUVVZGaXVsUQ?oc=5) |
| qz.com | TSMC and Samsung commit to ASML High NA EUV machines for AI chips | [Source Link](https://news.google.com/rss/articles/CBMibEFVX3lxTFBselZ5UDR5TTVSUkhQTUZaaUNLMHdCOTJzNlNsVVJPWlkxSEVXOGdlT0lDVmYtcUdHSzFWcWpfZWprTmpTeVl5ZHdoakNqN2ZHUVpEelhGZzRCU01VUEVKLXNyeWhLVFZVb3pvdg?oc=5) |

---
*Canonical Source: https://pulse.byoviral.com/trend/2026-09-08/asml-to-work-with-major-chipmakers-to-use-latest-tools-for-larger-chips*