Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports

Current reporting highlights a major manufacturing shift in the semiconductor sector regarding advanced hardware production. According to coverage from Reuters, a Seoul newspaper reports that Samsung intends to utilize technology from TSMC for next-generation memory chips destined for Nvidia. Additional reports from Tech Times, Electronics Weekly, TradingView, and The Information corroborate aspects of this technological realignment. Specifically, coverage details that Nvidia has instructed suppliers to tap the TSMC process for these next-generation components. Tech Times notes that Samsung is outsourcing its Nvidia AI memory base dies to TSMC, directly linking the decision to foundry yields falling short. Furthermore, the reporting from Electronics Weekly indicates that this strategy is not isolated to a single manufacturer.

Alongside Samsung, firms like Micron and Hynix will also use TSMC base dies for NVHBM components. TradingView outlines that Samsung has formally accepted the required terms set by Nvidia, while also mentioning a separate artificial intelligence pact involving Banco Santander. The Information first reported that Nvidia directed its suppliers to utilize the TSMC process for these upcoming memory chips. Outlets such as Reuters have amplified these findings following the initial publications, drawing widespread attention from industry analysts tracking the semiconductor supply chain. This development occurs against a backdrop of intense global demand for advanced artificial intelligence hardware and high-bandwidth memory. The integration of TSMC manufacturing processes into the production pipelines of competing memory makers highlights the specialized nature of advanced silicon fabrication.

While coverage does not yet specify full contractual timelines, the reports establish that major memory producers are modifying their manufacturing approaches to meet technical demands. The involvement of multiple suppliers including Samsung, Micron, and Hynix points toward a standardized reliance on TSMC capabilities for the specific base dies required in next-generation memory architecture. Observers and industry participants will be watching for official confirmations from the companies involved regarding production schedules and capacity allocations. Coverage currently relies on reports from specialized technology publications and daily financial news services, leaving open questions about the exact financial terms of the arrangements. As the semiconductor ecosystem adapts to these manufacturing directives, further updates will likely clarify how Samsung, Micron, and Hynix manage their foundry operations alongside the utilization of TSMC technology for Nvidia products.